X-Ray Fluoroscopic Examination
Addressing the problems involved with analysis of complex devices, our Company inspects electronic devices, printboards and other components without damaging the product employing radiation and sonography, etc. whilst investigating product safety and quality. Both, miniature and large parts, can be inspected with CT, enabling numerous data acquisitions including, tomograms, stereoscopy, multi-point tomograms （MPR images） and more. Hereafter, we introduce transmission inspection technology with X-ray CT and microfocus X-ray CT.
Problems and Measures of Complex Device Analysis
Conventional X-ray examination mainly involved 2-dimensional transmission analysis using the transmission X-ray observation method rendering confirmation of complex device structures problematic. In order to countermeasure, our Company has established observation conditions and an image diagnosis technology tailored to specific test objects by means of stereoscopic transmission examination technology using microfocus X-ray.
Analysis Examples Using Micro X-Ray CT
Observation Example of Multi-Conductor Cable Ablation
With just external visual inspection interruptions in multi-conductor cables cannot be detected, however, using X-ray transmission stereoscopic views as well as X-ray CT analysis （3D stereoscopic models） wire break locations can be confirmed from all angles.
X-Ray CT inspection image
Example of X-ray CT Analysis of a Cellular Phone
With 2-dimensional imaging hidden locations are hard to confirm, but can be easily analyzed with stereoscopic and cross-sectional views thanks to X-ray CT analysis.
3D stereoscopic image
MPU magnification （3D）
Solder Molten State Analysis Example for BGA Joints
We have observed the behavior of solder in real-time with X-ray transmission. Dynamic observations of heating conditions are possible with a device heating unit.
Analysis Aspects of X-Ray CT Observation Methods
X-ray CT inspection methods unveil detailed structures of complex test objects, such as electronic devices, printed circuit boards and other components. Furthermore, the delivered 3-dimensional data grants non-destructive inspection of chassis and packages. A rapid improvement of detection rate of defect factors can be expected compared with two-dimensional data imaging.