Dynamic Burn-in Tests

A burn-in test is a method by which temperature and voltage loads are applied to devices aiming at reduction of initial failures by timely detection. Among all product screening tests employed by a large number of business categories, including automotive, aerospace & defense, social infrastructure corporations, etc., is one of the most effective tests for early failure detection.

Carried out by operating the device under high temperature, dynamic burn-in is a screening simulating application conditions close to real use. It is also expected to help understand characteristics variations beforehand as commercial product failure recently comes up more frequently.

Efficiency of Burn-in

• Supply of devices with stable quality
• Maintain customer satisfaction with high quality products
• Prevent failure devices from shipping into the market
• Remove defect products at initial stage
• Grasping characteristics variation in case of channel product usage.

Applicable Product Categories

• From general-purpose logic ICs to ASICs and mixed analog SoC
• Memories (SRAM, PROM, EEPROM, etc.)
• High reliability components for aerospace equipment (FPGA, EPROM, EEPROM, RTAX2000, RTSX32, RTSX72, RH1280, etc.)

Removal of Early Failures

Electrical Characteristics Test

Characteristics Variation of Channel products by means of Dynamic Burn-in.

Example:

Burn-in Test Example

The problem of initial cost increase is raised if burn-in boards have to be re-manufactured because, especially in case of FPGAs, pin settings can alter I/O conditions. In response to this problem, we provide dynamic burn-in tests supporting high-capacity test patterns at relatively low cost.

Individual specifications can apply alongside standard specs.

Dynamic burn-in test example

• List of Services
• EMC Test
• Environmental Systems
• Instruments Calibration
• Reliability Test, Evaluation and Analysis
• Integrated ESD Service
• Tester Program & Device Testing
  • Next-Generation Power Semiconductors
  • Test Solution Services for Testers Manufactured by Cloud Testing Service Inc.(CTS)
  • Reliability Evaluations of Non-volatile Memory
  • Power Supply Modules
  • Power Plug Tracking
  • AEC-Q100 Tests
  • Test Program Development
  • Wafer-level Reliability Evaluation
  • Measurements and Evaluations
  • Screening
    • Screening Flow
    • Screening Jig Manufacture
    • Dynamic Burn-in
    • Passive Components Screening
    • FPGA Screening for Deployment in Space
    • Screening for Counterfeit Electronic Parts
  • Major Equipment for Electronic Devices Testing

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