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Dynamic Burn-in Tests

A burn-in test is a method by which temperature and voltage loads are applied to devices aiming at reduction of initial failures by timely detection. Among all product screening tests employed by a large number of business categories, including automotive, aerospace & defense, social infrastructure corporations, etc., is one of the most effective tests for early failure detection.

Carried out by operating the device under high temperature, dynamic burn-in is a screening simulating application conditions close to real use. It is also expected to help understand characteristics variations beforehand as commercial product failure recently comes up more frequently.

Efficiency of Burn-in

  • Supply of devices with stable quality
  • Maintain customer satisfaction with high quality products
  • Prevent failure devices from shipping into the market
  • Remove defect products at initial stage
  • Grasping characteristics variation in case of channel product usage.

Applicable Product Categories

  • From general-purpose logic ICs to ASICs and mixed analog SoC
  • Memories (SRAM, PROM, EEPROM, etc.)
  • High reliability components for aerospace equipment (FPGA, EPROM, EEPROM, RTAX2000, RTSX32, RTSX72, RH1280, etc.)

Removal of Early Failures

Removal by Screening

Electrical Characteristics Test

Electrical characteristics test

Characteristics Variation of Channel products by means of Dynamic Burn-in.

Example:

Electrical characteristics test

Burn-in Test Example

The problem of initial cost increase is raised if burn-in boards have to be re-manufactured because, especially in case of FPGAs, pin settings can alter I/O conditions. In response to this problem, we provide dynamic burn-in tests supporting high-capacity test patterns at relatively low cost.

Test pattern step count 1,000,000 steps max. (1 step for signal change points)
Test pattern format Besides general logic signals ("1","0"), the VCD format, WGL, STIL supported
Test pattern count Test possible with a maximum of 4 test patterns in parallel.
Maximum signal count 256 signal lines
Power supply systems Standard spec: 2 systems (optionally more than 2 possible)
Power supply voltage Standard spec: Vcc Core (2.25V to 6.00V), VccIO (3.00V to 6.00V)
Input voltage Standard spec: VIH (2.00V to 5.5V), VIL (less than 0.4V)

Individual specifications can apply alongside standard specs.

Dynamic burn-in test example
Dynamic burn-in test example

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