Test and Evaluation of Bare Chips

OKI Engineering now offers evaluation and testing of bare chips!

Assembly (packaging process) can be skipped thanks to the possibility of evaluation in bare chip state as directly delivered from the foundry bringing advantages such as reduction of assembly and transportation cost, assembly time and risks inherent to assembly and transportation.
We provide a one-stop-solution including program development, probe card manufacture, wafer testing for shuttle user customers in need for evaluation of wafers and bare chips in small quantities.

For Shuttle Service Customers with Low Quantity Wafer Productions

OKI Engineering performs wafer testing in quantities starting from a single wafer. We implement testing upon support with our customers about delivery schedule, test items and test conditions. Our expert engineers will provide reassured, safe technology services.

Advantages of Bare Chip Testing

Conventionally, upon request by shuttle user customers a shuttle is manufactured in the foundry and then the bare chips are assembled and tested by an assembly company. Now, should any defects be detected during evaluation, this entire process must be repeated to improve the chips.
OKI Engineering's testing service for bare chips directly delivered from the foundry eliminates doubled production processes by means of testing before device assembly, thus reducing cost and risk of failure in short time.

Our on-time service accurately responds to needs for evaluation under specified conditions for small quantities -- a true one-stop solution from program development and probe card manufacture all the way up to reliable evaluations.

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