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AEC-Q100 TestsAll tests are compliant with Automotive Electronics Council (AEC-Q100) regulations.
AEC-Q100 is a technical standard for various reliability tests for integrated circuits (IC) developed for automotive applications. We at OKI Engineering conduct all AEC-compliant reliability tests for automotive ICs.
AEC-Q100 Test Items
AEC-Q100 Environmental Stress Test
| Referenced Standard | Symbol | Test Item Details |
|---|---|---|
| JESD22 A113 J-STD-020 |
PC | Preconditioning SMD only; moisture preconditioning for THB/HAST, AC/UHST, TC & PTC |
| JESD22 A101 JESD22 A110 |
THB or HAST |
High temperature/high humidity bias test Highly-accelerated stress test |
| JESD22 A102 or JESD22 A118 |
AC or UHST |
Autoclave Unbiased highly-accelerated stress test |
| JESD22 A104 | TC | Temperature cycling test |
| JESD22 A105 | PTC | Power and temperature cycling test |
AEC-Q100 Accelerated Life Tests
| Referenced Standard | Symbol | Test Item Details |
|---|---|---|
| JESD22 A108 | HTOL | High temperature operation life |
| AEC-Q100-0008 | ELFR | Early failure rate |
| AEC-Q100-0005 | EDR | Program/erase endurance, data retention (Non-volatile memory) |
AEC-Q100 Package Assembly Integrity Tests
| Referenced Standard | Symbol | Test Item Details |
|---|---|---|
| AEC-Q100-001 | WBS | Wire bond shear strength |
| Mil-STD-883 Method2011 |
WBP | Wire bond pull strength |
| JESD22 B102 | SD | Solder wettability |
| JESD22 B100 JESD22 B108 |
PD | Physical dimension |
| AEC-Q100-010 | SBS | Solder ball shear strength |
| JESD22 B105 | LI | Lead integrity |
AEC-Q100 Die-Level Reliability Tests
| Referenced Standard | Symbol | Test Item Details |
|---|---|---|
| JESD61 | EM | Electromigration |
| JESD35 | TDDB | Time-dependent dielectric breakdown (oxide film life) |
| JESD60&28 | HCI | Hot carrier injection test |
| JESD90 | NBTI | Negative bias temperature instability |
| JESD61，87，&202 | SM | Stress migration |
AEC-Q100 Electrical Characteristics Assessment
| Referenced Standard | Symbol | Test Item Details |
|---|---|---|
| User/Supplier Specification | TEST | Pre and post electrical stress test |
| AEC-Q100-002 AEC-Q100-003 |
HBM/MM | Human model/machine model electrostatic discharge test |
| AEC-Q100-011 | CDM | Charged device model electrostatic discharge test |
| AEC-Q100-004 | LU | Latch-up |
| AEC-Q100-009 | ED | Electrical distribution assessment |
| AEC-Q100-006 | GL | Gate leakage |
AEC-Q100 Cavity Package Test (Ceramic Package)
| Referenced Standard | Symbol | Test Item Details |
|---|---|---|
| JESD22 B104 | MS | Mechanical shock test |
| JESD22 B103 | VFV | Variable frequency vibration test |
| MIL-STD-883 Method 2001 |
CA | Constant acceleration test |
| MIL-STD-883 Method 1014 |
GFL | Gross and fine leakage test |
| - | DROP | Drop test |
| MIL-STD-883 Method 2004 |
LT | Lead torque test |
| MIL-STD-883 Method 2019 |
DS | Die shear test |
| MIL-STD-883 Method 1018 |
IWV | Internal water vapor contents test |
