Failure Analyses

Failure analysis is a process by which the nature of product defect is understood and defect locations investigated by measuring electrical characteristics and performing various observations.

It has the objective of securing product quality and manufacturers' reliability by specifying the production lot in which defects occur, by minimizing the extend of problems and by chartering a course for production and usage improvement.

Failure analysis span over a wide area, from electronic parts such as LSIs, resistors, capacitors, switches, connectors, printboards, etc. to electric components and contact points.

• 
  Scanning Electron Microscope （SEM）
• 
  Case of overcurrent defect observation

• 
  Scanning Acoustic Tomograph （SAT）
• 
  Case of chip crack observation

• 
  X-Ray CT Equipment
• 
  X-Ray CT Image

• 
  Transmission Electron Microscope （TEM）
• 
  Case of FIB cut-out

• List of Services
• EMC Test
• Environmental Systems
• Instruments Calibration
• Reliability Test, Evaluation and Analysis
  • Vibration and Shock Tests
  • Failure Analyses
  • Non-defective Analyses
  • Non-Destructive Testing
  • Observations and Analyses
  • X-Ray Fluoroscopic Examination
  • Ion Migration Tests for Printboards
  • Lead-free Assembly Evaluation
  • Environmental Reliability Testing
  • Special Environmental Tests
  • Dust & Dust Endurance Tests
  • Salt Spray Tests
  • Gas Corrosion Tests
• Integrated ESD Service
• Tester Program & Device Testing

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