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Failure Analyses

Failure analysis is a process by which the nature of product defect is understood and defect locations investigated by measuring electrical characteristics and performing various observations.

It has the objective of securing product quality and manufacturers' reliability by specifying the production lot in which defects occur, by minimizing the extend of problems and by chartering a course for production and usage improvement.

Failure analysis span over a wide area, from electronic parts such as LSIs, resistors, capacitors, switches, connectors, printboards, etc. to electric components and contact points.

  • SEM
    Scanning Electron Microscope (SEM)
  • Case of overcurrent defect observation
    Case of overcurrent defect observation
  • SAT
    Scanning Acoustic Tomograph (SAT)
  • Case of chip crack observation
    Case of chip crack observation
  • X-Ray CT Equipment
    X-Ray CT Equipment
  • X-Ray CT Image
    X-Ray CT Image
  • TEM
    Transmission Electron Microscope (TEM)
  • Case of FIB cut-out
    Case of FIB cut-out

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