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Non-defective Analyses
Non-defective analysis is a process of investigations ranging from observations of product condition or deficiency through to estimation of future failure risk, each and every step resulting in process improvement.
As a practical example, product quality comparision investigations are performed for LSIs, electronic components, printboards, etc and acceptance decisions made in accordance with various standards. Furthermore, non-defective analysis additionally helps extract process problems.
We evaluate by a "Process Diagnosis" which is based on proprietary evaluation items and criteria well selected from past failure analysis results and documents applied to the technique of non-defective analysis of LSI chips.
We are proposing this "Process Diagnosis" as an most encouraging means of selection of current devices with improved reliability.
Example: deficiency detected by ultrasonic examination
The white portion denotes avulsion between package and chip
Wire bonding disconnection as a result of package avulsion
TEM observation case at process diagnosis
Residual dislocation in Si-board as a result of ion implantation
