Addressing the problems involved with analysis of complex devices, our Company inspects electronic devices, printboards and other components without damaging the product employing radiation and sonography, etc. whilst investigating product safety and quality. Both, miniature and large parts, can be inspected with CT, enabling numerous data acquisitions including, tomograms, stereoscopy, multi-point tomograms (MPR images) and more. Hereafter, we introduce transmission inspection technology with X-ray CT and microfocus X-ray CT.
Conventional X-ray examination mainly involved 2-dimensional transmission analysis using the transmission X-ray observation method rendering confirmation of complex device structures problematic. In order to countermeasure, our Company has established observation conditions and an image diagnosis technology tailored to specific test objects by means of stereoscopic transmission examination technology using microfocus X-ray.
Conventional | Measure | |
---|---|---|
X-Ray Examination |
|
|
With just external visual inspection interruptions in multi-conductor cables cannot be detected, however, using X-ray transmission stereoscopic views as well as X-ray CT analysis (3D stereoscopic models) wire break locations can be confirmed from all angles.
With 2-dimensional imaging hidden locations are hard to confirm, but can be easily analyzed with stereoscopic and cross-sectional views thanks to X-ray CT analysis.
We have observed the behavior of solder in real-time with X-ray transmission. Dynamic observations of heating conditions are possible with a device heating unit.
X-ray CT inspection methods unveil detailed structures of complex test objects, such as electronic devices, printed circuit boards and other components. Furthermore, the delivered 3-dimensional data grants non-destructive inspection of chassis and packages. A rapid improvement of detection rate of defect factors can be expected compared with two-dimensional data imaging.