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Example Cases
Example Cases
OKI Engineering performs reliability evaluation tests and failure analysis for numerous kinds of electronic components （such as ICs, chip capacitors, relays and printboards） as well as for units and materials. Please feel welcome to ask us about your interest, expectations and questions.
TEST OBJECTS: ICs, LSIs
| Characteristics Evaluation | Program development, jig manufacture （burn-in and measurement） for general purpose LSIs |
|---|---|
| Elevated H/L temperature tests for LSIs | |
| Normal temperature LSI tests （SRAM, DRAM, ASIC, ROM, FPGA, standard logic, linear LSI/MCM） | |
| Reliability Tests | LSI failure rate （lifetime） tests |
| FPGA screening tests | |
| LSI environment and durability tests | |
| ROM retarding tests | |
| LSI burn-in | |
| Reflow tests （ultrasonic microscope, SEM） | |
| LSI screening tests | |
| ESD, latch-up characteristics tests | |
| Degradation Tests | Appropriateness of conversion cycles by lifetime examination for LSIs in use. |
| Failure Analyses | LSI failure analysis （apparent condition tests, electrical specifications, transmission X-ray, ultrasonic microscope, sealing, inward look ） |
| Membrane removal by etch-back （RIE wet） followed by inspections （optical microscope, SEM） | |
| Unsealing of LSIs （ceramic, can, mold resin） | |
| Elemental analysis of failure location （EPMA, AES） - foreign substance analysis between lead terminals capillary terminals, etc. （EPMA） | |
| Surface defect investigation （optical microscope, SEM） | |
| Solder plating peel-off analysis （SEM, EPMA） | |
| Identification of defect location （liquid crystal method, hot emission microscope, potential contrast method, infrared microscope, etc.） | |
| Solder bump boyd investigation （transmission X-ray） | |
| Internal defect investigation （infrared microscope） | |
| Examination of source of aluminum wire corrosion （EPMA） | |
| Inspection of defect location cross-section （FIB, SEM, TEM） | |
| Analysis of aluminum pad surface defect caused by bonding peel-off, etc. （EPMA, AES） | |
| Non-Defective Analyses | Non-defective analysis in mounted state or on surface （MCM, packaged） |
| DPA （Destructive Physical Analysis） for MIL specificied devices | |
| Non-defective analysis for device cross-section structures | |
| Membrane removal by etch-back （RIE wet） followed by inspections （optical microscope, SEM） | |
| Bond pull tests | |
| Analyses | Analysis of mixed devices from other companies （optical microscope, SEM） |
| Evaluation of contamination on metal surfaces of wafers （total reflection fluorescent X-ray） | |
| Analysis of elementary structure of devices from other companies （TEM, SEM） | |
| Inspection of gate oxide thickness and interface （TEM lattice image） | |
| Analysis of contact structure defect （TEM） | |
| Thickness analysis of insulating ONO film of capacitors （TEM） | |
| Inspection of wiring interface boyd （FIB, TEM） | |
| Inspection of silicide reactions （AES, TEM） | |
| Evaluation of device crystallization defect | |
| Measurement of crystal grain size on Al and Cu wiring （FIB, TEM） | |
| Measurement of impurity distribution in silicon, etc. （SIMS） | |
| Moisture analysis of interlayer insulation film （TDS） | |
| Wafer lifetime measurement | |
| Analysis of natural oxidation film （XPS） | |
| Surface analysis of silicon （TDS, XPS） | |
| State analysis of intermetallic compounds in Al wire and Au pad interfaces （EPMA） | |
| Evaluation of silicon/polysilicon surface roughness （AFM, TEM） | |
| Miscellaneous | Wiring repair using FIB |
TEST OBJECTS: Electronic Components （non-IC/LSI）
| Characteristics Evaluation | Characteristics evaluations of transitors and diodes |
|---|---|
| Characteristics evaluations of LED parametric | |
| Evaluations of absolute values and impedances of resistors, coils, capacitors | |
| Fuse characteristic tests （fusing temperature, strength, etc.） | |
| Reliability Tests | Failure analysis and lifetime tests for transistors, diodes, resistors, coils, capacitors, LEDs, etc.） |
| Screening tests for resistors and capacitors | |
| Environmental and endurance tests for components | |
| Fuse reliability tests （meltdown, vibration） | |
| Lifetime tests for electrolytic capacitors | |
| Degradation Tests | Lifetime tests for coils, capacitors, etc. |
| Failure Analyses | Failure analysis of components （visual inspection, electrical characteristics, transmission X-ray, sealing, internal inspection） |
| Elementary analysis of defect locations in tantalum capacitors （EPMA） | |
| Cause examination of short-circuiting in ceramic capacitors （EPMA） | |
| Cause investigation of capacitor lead fractures | |
| Components surface state inspections, cause analysis | |
| Failure inspection of film capacitors | |
| Analysis of LED luminance degradation （FIB, TEM） | |
| Transmission X-ray inspection of capacitors | |
| Non-Defective Analyses | DPA （Destructive Physical Analysis） for MIL specificied capacitors |
| Non-defective analysis of special capacitors and resistors | |
| Evaluation of nonconforming products | |
| Analyses | Fuse fracture cross section inspection （SEM） |
| Impurity distribution in diode boards （EPMA-WDX） | |
| Analysis of MOS transistor cross-section structure （optical microscope, SEM） |
TEST OBJECTS: Connection Devices （Electromechanical）, Boards
| Characteristics Evaluation | Contact resistance measurement |
|---|---|
| Insertion/extraction force measurement | |
| Solder wetting test | |
| Connector insertion/extraction test | |
| Plating thickness test | |
| Air-proof test for seal switches | |
| Bending tests | |
| Reliability Tests | Failure rate and lifetime tests for connection parts （connectors, switches, sockets, relays） and boards |
| Thermal shock reliability tests, etc., for multi-layer assembly boards | |
| Vibration tests for connection devices and boards | |
| Special environmental tests for assembly boards （particular gas and dust tests, etc.） | |
| Gas tests （H2S/SO2, mixed gasses） for connectors, switches and sockets | |
| Combustion tests for boards | |
| Thermal shock reliability tests, etc., for connectors | |
| Dust tests for optical connectors | |
| Thermal shock reliability tests, etc., for aluminum core boards | |
| Salt spray tests for plated portions | |
| Failure Analyses | Failure analysis for electromechanical devices （visual inspections, air-sealing tests, transmission microscope X-ray, degradation investigations） |
| Analysis of dust adhesion on printboards （EPMA） | |
| Cause investigation for connection failure at the contact point of relays, etc. | |
| Insulation deterioration analysis for printboards （EPMA） | |
| Cause investigation of connector corrosion （optical microscope, SEM, EPMA） | |
| Malfunction analysis of charge terminal connections （EPMA, AES） | |
| Non-Defective Analyses | Cross-section analysis of printboard through-holes |
| Cross-section analysis of connector fitting | |
| Analyses | Structure analysis of other companies' printboards （optical microscope, EPMA） |
| Analysis of gold-plated surface denaturation （EPMA） | |
| Composition analysis of relay materials （EPMA） | |
| Structure analysis of push-button switches （EPMA） | |
| Investigation of connector migration （EPMA） | |
| Inspection of crystal grain by solder degradation （SEM） |
TEST OBJECTS: Miscellaneous Devices
| Characteristics Evaluation | Characteristics evaluation of crystal oscillators |
|---|---|
| Evaluation board design for surface-mount devices （resistors, capacitors, transistors, crystal oscillators, connectors, pressure sensors, switches, etc.） | |
| Characteristics evaluation of transistors （winding, impedance, linear resistance | |
| Illuminance tests for lamps | |
| Strength test of optical fiber | |
| Operation characteristics of LCD panels under reduced pressure | |
| Insertion loss characteristics of optical fiber | |
| Reliability Tests | Environment tests for oscillators |
| Temperature, humidity, salt spray, vibration and shock tests for optical connectors | |
| Thermal shock reliability tests, etc., for optical sensors | |
| Lifetime tests for lamps | |
| Failure Analyses | Failure analysis for various components （visual inspections, electrical characteristics, defect investigations） |
| Malfunction analysis of LCD panels （optical microscope, EPMA） | |
| Observations for cause investigation, elementary analysis （optical microscope, SEM, EPMA） | |
| Analyses | Surface morphology of oscillators （AFM） |
| Fluorescent substance analysis for PDPs （EPMA） | |
| Cross-section structure analysis of crystal oscillator electrodes （TEM） |
TEST OBJECTS: Units and Equipment
| Characteristics Evaluation | DC voltage characteristics （static, input current, rush current, ripple, instant &intermittent discontinuity, wake-up, etc.） |
|---|---|
| Vibration characteristics of units （resonance point and structure defect inspections） | |
| Electrical characteristics of units （power supply, cards, modules, boards, cords, special units, such as automotive, printers, telephones） | |
| Characteristic evaluation of fan motors （start-up voltage, current & torque, rotation speed, ambient noise, air flow volume） | |
| Characteristics of AC cords （strength, warm-up by power distribution） | |
| Electrical characteristics of IC cards, modules | |
| Reliability Tests | Dust tests for units |
| Irradiation tests for IC cards （X-ray, UV, magnetic） | |
| Vibration and shock tests for units | |
| Equipment insulation tests （using an artificial climate chamber） | |
| Water-proof test for units | |
| Seismic tests for equipment （with seismic waves） | |
| Lightning surge tests for units | |
| Weather resistance tests for equipment （chill, dew, vibration, water-resistance） | |
| Failure Analyses | Failure analysis for units （visual inspections, electrical characteristics, defect investigations） |
| Recurrent malfunction tests （printers, power supplies, assembly boards, CCD cameras） | |
| Non-Defective Analyses | Condition of AC cord strength |
| Degradation Tests | Examination of degradation by heat generation |
| Analyses | Motor shaft breakage test |
| Structure investigation of optical element modules （optical microscope） | |
| Analysis of printer toner | |
| Analysis of LC module materials （optical microscope, SEM, EPMA） | |
| Analysis of electrical cable fractures （SEM） |
TEST OBJECTS: Materials and Others
| Characteristics Evaluation | Stress corrosion tests for metals |
|---|---|
| Plastic solvent crack test | |
| Atmospheric corrosion tests for metals | |
| Tear strength of thermal paper | |
| Pseudo-atmospheric corrosion tests for metals （special gas tests） | |
| Rubber climp tests | |
| Strength tests for metals, optical fiber, plastics, etc. | |
| Degeneration evaluation of materials （concentration, etc） | |
| Reliability Tests | Solvent resistance of plastics |
| Oil-proof tests for rubber | |
| Duration tests for rubber hoses | |
| Analyses | Analysis of silicon rubber characteristics （EPMA） |
| Analysis of exogenous surface adhesive （EPMA） | |
| Analysis of metal cross-section fractures （SEM） | |
| Evaluation of crystalline in Mn-Zn monolithic crystal ferrit （TEM） | |
| Analysis of peeling state of Au alloy clad bend section （SEM） | |
| Measurement of oxid layer thickness on copper wires （TEM） | |
| Quantitive analysis of WSi membrane thickness | |
| Structure analysis of superlattice （TEM） | |
| Analysis of optical lens contamination （EPMA） | |
| Surface structure analysis of super-conductive thin film （TEM） | |
| Structure analysis of ferroelectric thin film（TEM） | |
| Granularity measurement of colloid solutions （TEM） | |
| TiSi reflection electron beam diffraction （TEM） |
